Amphenol RF introduces the new generation of quality BNC connectors
for the telecommunication and broadband applications for higher
connector densities while preserving the positive characteristics
of the Amphenol full-size BNC's for 75
Ω systems. This allows 40%
more interconnects in the same area.
The Mini BNC series provides a positive locking bayonet system
where SMB and SMZ system have no locking feature. The SMB and SMZ
were not designed to be field installed or repaired, while the Mini
BNC is specifically designed to be a drop-in replacement and used
with the Telco DS3 application and is compatible with the present
field installer tooling and strip dimensions.
| Impedance |
75 Ω with acceptable return loss up through 1 GHz |
| VSWR |
1.10 max up to 750 MHz (Return Loss -26.44 dB )
1.16 max up to 1 GHz (Return Loss -22.61 dB)
MIL-STD-1344, method 3005
|
| Working Voltage |
400 VAC, peak |
| Dielectric Withstanding Voltage |
1000 VAC at 5 seconds minimum per MIL-STD-1344, method 3001,
test condition I |
| Contact Resistance |
Center contact: 12 m Ω initial, 12 m Ω after environmental,
per MIL-STD-202, method 307 |
| Insulation Resistance |
› 1,000 MΩ @ 500 volts per MIL-STD-1344, method 3003 |
| Insertion Loss |
0.1 dB maximum up to 1 GHz per MIL-C-39012 |
| Visual and Mechanical |
Visually examined to verify uniform quality and absence of
defects that would affect appearance, serviceability, and reliability. |
| Body |
Brass per ASTM-B16, nickel-plated per QQ-N-290, class 1, 0.0001
inches thick minimum
Zinc-alloy die cast per ASTM-B86, nickel-plated per QQ-N-290,
class 2, 0.0001 inches thick minimum is allowed as an alternative
|
| Bayonet Sleeve |
Brass per ASTM-B16, nickel-plated per MIL-C-26074, class 1,
0.0001 inches thick minimum.
Zinc-alloy die cast per ASTM-B86, nickel-plated per MIL-C-26074,
class 1, 0.00050 minimum over copper per MIL-C-14550, 0.000080
inches thick minimum.
|
| Insulator |
Solid PTFE per ASTM-D1710, type II or FEP per ASTM-D2116,
type II |
| Spring Finger |
Beryllium copper per ASTM-B194, age-hardened to Rc 36-44 or
phosphorous bronze per ASTM-B139; nickel-plated per QQ-N-290,
class 1, 0.0001 inches thick minimum. |
| Gasket |
Silicone per ZZ-R-765, class 2B |
| Spring Washer |
Beryllium copper per ASTM-B194, age-hardened to Rc 36-44,
nickel-plated per MIL-P-27418, 0.0002 inches thick minimum |
| Washer |
Brass per ASTM-B36, nickel-plated per QQ-N-290, class 1, 0.0001
inches thick minimum. Plastic is allowed as an alternative for
this component. |
| Crimp Sleeve |
Brass per ASTM-B16, sulfamate nickel-plated per MIL-P-27418,
0.0002 inches thick minimum. |
| Center Contact Retention |
The center contact shall not dislocate when an axial load
of 6 pounds is applied per MIL-STD-1344, method 2007. This is
a measurement of contact retention within the dielectric and
is tested prior to cable crimping. |
| Crimp Strength |
The crimp strength (cable retention) for the overall terminated
connector shall be as follows: 50 pounds minimum average for
735 type cables and 70 pounds minimum average for 734 type cables. |
| Spring Finger Engagement/Withdrawal Force |
The engagement force shall be 1.5 pounds minimum, 5 pounds
maximum and the withdrawal force shall be 12 ounces minimum
using a 0.246 +0.000/-0.001 I.D. 16 micro-inch finish steel
test ring gage. |
| Temperature Cycling |
Initial contact resistance shall be measured, followed by
50 12-hour cycles of -40°C to + 85°C with contact resistance
per paragraph 1.6 |
| Temperature Life |
Initial contact resistance per paragraph 1.5 shall be measured,
followed by 1000 hours of exposure at 105°C +/- 2°C
per MIL-STD-202, method 108, condition D |
| Corrosion Resistance |
MIL-STD-1344, method 1001, condition B |
| Durability |
500 cycles, not exceeding 10 cycles per minute |
| Ground Finger Continuity |
260 gram minimum load |
| Vibration |
MIL-STD-1344, method 1001 at 20 G's/10 Hz to 2 kHz |
| Mechanical Shock |
MIL-STD-1344, method 2004, condition D |
| Humidity |
504 hours at 40°C with a relative humidity of 90% to 95%
per MIL-STD-1344, method 1002, condition C |
