APC 3.5 短路帽
相关资源
Space Applications Solutions Overview
The Space Applications Overview Flyer from Amphenol RF highlights their RF interconnect solutions designed for use in space applications. It emphasizes the importance of reliable, high-performance connectivity in extreme environments, such as satellites, ground stations, unmanned exploration vehicles, space robotics, and telemetry systems.
Amphenol RF Solutions for Instrumentation
Amphenol RF offers a robust range of RF interconnect solutions specifically designed for instrumentation applications requiring high-frequency performance, low signal loss, and enhanced reliability. Their product portfolio includes various connectors such as 1.0-2.3, 2.92 mm, BNC, HD-BNC, N-Type, and SMA, along with precision adapters, RF adapters, and precision test cables—all engineered to minimize signal degradation and ensure consistent performance in demanding test environments. These solutions are ideal for applications like network and spectrum analyzers, signal generators, RF/microwave testing, telemetry systems, handheld testers, and automated test equipment. Amphenol’s core strengths lie in ruggedized designs that resist dust, vibration, and corrosion, IP67/IP68-rated waterproof sealing for protection against environmental elements, and high-precision, low-loss cable assemblies that support long-distance signal transmission.
Broadband Solutions Overview
The Broadband Solutions Overview presents a comprehensive look at the evolution of broadband technology, highlighting how advanced RF connectivity solutions are driving the future of high-speed internet access. From legacy DSL and coaxial systems to cutting-edge fiber optics, fixed wireless access (FWA), and satellite broadband, this document outlines the challenges and breakthroughs shaping modern digital infrastructure. It emphasizes Amphenol RF’s pivotal role in delivering robust, high-frequency, and custom RF components essential for seamless connectivity across diverse broadband platforms. Designed for engineers, integrators, and decision-makers, this overview is a definitive guide to the technologies and RF innovations enabling the next generation of global broadband connectivity.
White Paper: Passive Intermodulation Distortion
The document "Passive Intermodulation Distortion in Connectors, Cable and Cable Assemblies" by David Weinstein of Amphenol Corporation discusses the causes, impacts, and measurement of Passive Intermodulation Distortion (PIM) in RF components. It explains how PIM is generated by non-linear mixing in passive devices like connectors and cables, causing unwanted signals that can interfere with communication systems. The paper outlines design guidelines to minimize PIM, including contact design, material choices and cleanliness, and describes testing methods to ensure low PIM performance.
5G Wireless Solutions
The Amphenol RF 5G Wireless Solutions document presents Amphenol’s advanced RF interconnect solutions tailored for next-generation 5G networks. It highlights a comprehensive portfolio of high-performance connectors, adapters, and cable assemblies designed to support the high-frequency, low-latency, and high-data-rate demands of 5G infrastructure. The document emphasizes low PIM performance, robust durability, and compact designs, ensuring reliable connectivity in macro cell sites, small cells, distributed antenna systems (DAS), and massive MIMO applications.
Antenna Solutions for Wireless Applications
The Amphenol RF Antenna Solutions Overview provides an in-depth look at a wide range of high-performance antennas designed for wireless applications. It highlights key features, including compact designs, high-frequency capabilities, and compatibility with various RF interconnect solutions for seamless connectivity across industries.
SCTE Expo Imagine Zone - The Future of RF Connectors: 10G and Beyond
The Future of RF Connectors for DOCSIS 4.0 and Beyond
The introduction of NDX, a new futureproof RF connector explicitly designed for DOCSIS 4.0 networks and the trend for consumer-facing self-installations.
This presentation will explore the need to supplant the venerable Type F connector in order to improve robustness, reduce the total cost of ownership, and provide high performance for 10G and beyond.
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