The HD-EFI product series is a micro-miniature interface designed to allow large board tolerance stack ups, blind mating, and multiple RF lines. It is available in common PCB jack and cable plug configurations, with an assortment of bullet adapters to accommodate many board to board spacing options.

The HD-EFI interface is a proprietary design, allowing for a very stable RF signal over the full axial range of the connector system. It has generous “float” to compensate for the axial and radial misalignment tolerance common in small package sized applications.

The interface is available as a 50 ohm connector system with a performance of DC to 6 GHz, making them ideal for high-performance applications with a small package size.

Download the HD-EFI Solutions Guide Catalog

Features and Benefits

Performance to 6 GHz for 50 ohm systems
Proprietary configuration designed to maximize radial and axial float in board-to-board applications
Closed entry interface and crash-proof mating design
Ideal for blindmating and multiple RF lines between boards

Applications

Wireless Base Station Equipment
Multiple Board to Board Connections
Complex PCB Stack-ups
Military/Aerospace
Broadband
Routers
Telecommunications

Related Products

HD-EFI Adapters

HD-EFI Connectors Specifications

Electrical

Items
Impedance	50 Ohm
Frequency Range	DC - 6 GHz
Voltage Rating	335 Volts RMS Continuous
Dielectric Withstanding Voltage	1000 Volts RMS Max
VSWR (Return Loss)
Axial Misalignment ± 0.7 mm
DC - 2 GHz	1.14 (-24 dB) Max
2 - 4 GHz	1.22 (-20 dB) Max
4 - 6 GHz	1.38 (-16 dB) Max
Axial Misalignment ± 0.3 mm
DC - 2 GHz	1.08 (-28 dB) Max
2 - 4 GHz	1.12 (-25 dB) Max
4 - 6 GHz	1.2 (-21 dB) Max
Insulation Resistance	5000 MΩ Min
Center Contact Resistance	5 mΩ Max
Outer Contact Resistance	5 mΩ Max
Insertion Loss
DC - 3 GHz	-0.14 dB Max
3 - 6 GHz	-0.27 dB Max
3rd Order Intermodulation	930 & 955 MHz (2X43 dBm), -163dBc Max (Low PIM Designs)
Power Handling	40 W Max @ 2.6 GHz @ 95ºC
	120 W Max @ 2.5 GHz @ 95ºC

Environmental

Items
Temperature Range	−45°C to +125°C
Thermal Shock	MIL-STD-202, Method 107, Condition B
Corrosion	MIL-STD-202, Method 101, Condition B - 5% Salt Spray
Vibration	MIL-STD-202, Method 204, Condition B
Mechanical Shock	MIL-STD-202, Method 213, Condition A - No Discontinuity Permitted
Humidity/Temperature Cycling	MIL-STD-202, Method 106, Condition A
Temperature Life	250 Hours at 125° C, No Damage to Parts

Mechanical

Items
Mating Cycles	50 Min (Limited Detent), 200 Min (Smooth Bore)
Coupling Mechanism	Push-On
Interface Specification	Amphenol RF Proprietary
Engagement Force	12 N Max (Smooth Bore), 25 N Max (Limited Detent)
Disengagement Force	2 - 6 N (Smooth Bore), 9 N Min (Limited Detent)
Mechanical Misalignment
Axial	±0.7 mm
Radial	±0.7 mm
Max Float Angle	5⁰ Surface Mount Parts, 3.5⁰ Through-hole Mount Parts
Min Board to Board Distance	11.46 mm

Note: These characteristics are typical and may not apply to all connectors.
Connector configurations may affect performance.