Sealed solutions are designed to protect against water and dust ingress that may occur in harsh environments such as those where the electrical system is exposed to the elements.
Non-mag products are primarily used in medical applications such as magnetic resonance imaging (MRI) equipment where RF signals need to be carried within a magnetic field.
QPL products are in compliance with all federal and defense department requirements.
12G products are specifically designed for 4K and Ultra-HD broadcast applications that require signal transmission through 12 Gbps.
Amphenol Ruggedized Connectors (ARC) are engineered for superior performance when exposed to extreme conditions.
Wide portfolio of board-to-board solutions engineered to maximize radial and axial float, elimination the need for cables between boards and simplifying designs to eliminate assembly errors. Typical designs are three-pieces and include a bullet adapter mated between smooth bore and detent PCB jacks.
PIM, or Passive Intermodulation, refers to interfering signals that diminish the performance of wireless networks.
Reliable, high performance products for applications that require extended frequency ranges.
Secure and easy coupling mechanism for reliable quick locking capabilities.
Compact designs with small footprint and low profile for applications with space constraints.
Connectors designed with extra layer of protection to protect against possible theft in outside or other less secure locations..
Amphenol RF has an RF connector, adapter or cable assembly to support just about any application that an engineer can dream up. If we don’t have a standard off-the-shelf product that solves the problem, our highly capable global engineering team can develop a custom, application specific solution designed to meet or exceed your requirements. Our standard solutions include RF interconnect designed for a variety of unique conditions including harsh environments with waterproof IP-rated, ruggedized and/or tamper resistant products and compact spaces utilizing board-to-board and/or ultraminiature interconnect. Our engineering capabilities expand to 12G SDI, low PIM, high-frequency, quick-locking and QPL military approved parts as part of our standard product lines.